| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of using existing facilities even when a diameter of a wafer becomes large.SOLUTION: A wafer processing method comprises the steps of: forming a groove having a depth equivalent to a finishing thickness of a device along all division schedule lines of the first and second directions formed on a surface of a wafer; generating a fan-shaped 1/4 wafer piece by cutting a division schedule line of a first direction passing substantially the center of the wafer and a division schedule line of a second direction passing substantially the center of the wafer; arranging a protection member on the surface of the 1/4 wafer piece; and holding the protection member side on a chuck table of a grinding device, exposing the groove by thinning the 1/4 wafer piece into the finishing thickness of the device by grinding a rear surface of the 1/4 wafer piece, and dividing the 1/4 wafer piece into individual devices. |
