发明名称 INSULATION BASE AND SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide an insulation base that makes it difficult for split and warp to occur regardless of heating and cooling.SOLUTION: An insulation base 100 according to the invention comprises first heat conductive materials 11 of insulation properties and an elastic material 12 of insulation properties. The first heat conductive materials 11 are spread with spaces between them and the elastic material 12 is injected into the spaces so that they are integrated. An insulation base 200 according to the invention further comprises a second heat conductive material 11A different from the first heat conductive material 11 in heat conductivity. The second heat conductive material 11A are spread with spaces between them in an area different from the area where the first heat conductive material 11 are spread, and the elastic material 12 is injected into the spaces of the first heat conductive material 11 and the spaces of the second heat conductive material 12 so that they are integrated.</p>
申请公布号 JP2014093342(A) 申请公布日期 2014.05.19
申请号 JP20120241695 申请日期 2012.11.01
申请人 MITSUBISHI ELECTRIC CORP 发明人 ISHIMURA CHOICHI
分类号 H01L23/12;H01L23/36 主分类号 H01L23/12
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