发明名称 COATING FILM REMOVAL METHOD OF SUBSTRATE PERIPHERAL EDGE PART, SUBSTRATE TREATMENT DEVICE, AND STORAGE MEDIUM
摘要 <p>PROBLEM TO BE SOLVED: To provide a technology capable of easily adjusting a device for executing removal, when removing an unnecessary part of a coating film in a peripheral edge part of a circular substrate surface in a ring shape.SOLUTION: Treatment is executed so as to include: a coating film removal step of removing a coating film in a ring shape in a preset width dimension, by supplying a solvent from a solvent nozzle to a peripheral edge part of the coating film of the surface of the substrate, while rotating the substrate around its orthogonal axis, by holding the reverse surface side of the circular substrate by delivering to a holding part by a carrier; then, a step of carrying the substrate to an inspection module for inspecting a state of the coating film by imaging the whole surface of the substrate; afterwards, a step of detecting a removal area of the coating film based on image data acquired by the inspection module and a step of correcting a delivery position of a succeeding substrate to the holding part by the carrier based on this detection result.</p>
申请公布号 JP2014091105(A) 申请公布日期 2014.05.19
申请号 JP20120244310 申请日期 2012.11.06
申请人 TOKYO ELECTRON LTD 发明人 TOMITA HIROSHI;KUNO KAZUYA
分类号 B05D3/00;B05C11/08;B05C11/10;G03F7/42;H01L21/027 主分类号 B05D3/00
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