发明名称 |
SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element which can ensure endurance for use in flip-chip mounting.SOLUTION: In a semiconductor element including bumps 60 each having a step-like shape as bump electrodes for flip-chip mounting, the bump 60 includes a first bump part 61 which forms a first stage of the step-like shape, a second bump part 63 which forms a second stage of the step-like shape and a first coating layer 62 which is formed by a formation material different from a formation material of the first bump part 61 and which is at least arranged so as to lie between the first bump part 61 and the second bump part 63. |
申请公布号 |
JP2014093318(A) |
申请公布日期 |
2014.05.19 |
申请号 |
JP20120241126 |
申请日期 |
2012.10.31 |
申请人 |
DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
OTA YUTAKA;TOYODA TATSUNORI |
分类号 |
H01L33/32;H01L21/60;H01L33/38 |
主分类号 |
H01L33/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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