发明名称 ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component that allows improving the magnetic permeability of an adhesive layer while preventing peeling and cracks from occurring between a magnetic body and a nonmagnetic body.SOLUTION: An electronic component 10 according to the present invention includes: magnetic body portions 30 and 32; a nonmagnetic body portion 22; a sintered body 12 formed by sintering adhesive layers 26 and 28 interposed between the magnetic body portion 30 and the nonmagnetic body portion 22 and between the magnetic body portion 32 and the nonmagnetic body portion 22; and circuit elements 16a and 16b. The adhesive layers 26 and 28 are composed of a magnetic material constituting the magnetic body portions 30 and 32, a nonmagnetic material constituting the nonmagnetic body portion 22, and a filler. The thermal expansion coefficient of the nonmagnetic material falls between the thermal expansion coefficient of the magnetic material and the thermal expansion coefficient of the filler.
申请公布号 JP2014093341(A) 申请公布日期 2014.05.19
申请号 JP20120241693 申请日期 2012.11.01
申请人 MURATA MFG CO LTD 发明人 KUDO NORIZANE ; KITAMURA MIHO ; KIDO TOMOHIRO
分类号 H01F17/00;H01F27/00;H01F41/04 主分类号 H01F17/00
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