| 摘要 |
A substrate bonding apparatus is provided to combine an elevating member for elevating and supporting a lower chamber to an external frame by a fixing device, thereby increasing the lower chamber supporting force of the elevating member. An upper substrate is loaded at an upper chamber(200). A lower substrate is loaded at a lower chamber(300). The lower chamber is combined with the upper chamber so that a bonding space is formed. An elevating member(400) elevates and supports the lower chamber. A fixing device(600) is combined with the elevating member and attached at an external frame(100) by means of magnetic force so that the lower chamber supporting force of the elevating member is increased. The upper chamber is fixed to the external frame. The fixing device includes a magnetic member attached at the frame by means of the magnetic force. A moving member moves the magnetic member. The fixing member also includes an electricity supply member for supplying the electricity to the magnetic member. |
