| 摘要 |
The present invention relates to a substrate cleaning apparatus, and particularly, to a substrate cleaning apparatus which can clean a substrate by spraying fine bubbles onto the substrate. A bubble jet cleaning device is spaced apart from the substrate at a predetermined interval in parallel with the substrate, is formed in such a manner that the width between the upper side and the lower side of both ends in the longitudinal direction becomes smaller corresponding to an inclined side of the substrate as the bubble jet cleaning device faces from the upper side to the lower side of the substrate, and generates fine bubbles while cleaning liquid is sprayed out in the form of fine particles through a discharge part. Therefore, the substrate cleaning apparatus can make the cleaning liquid exist on the substrate uniformly, prevent loss of cleaning liquid, and effectively clean the substrate through the fine bubbles which are prominent at removing foreign matters of fine particles. Furthermore, the substrate cleaning apparatus can prevent a damage of thin film formed on the substrate, is more eco-friendly than chemical cleaning liquid and plasma treatment in removing organic foreign matters, and can reduce process costs. |
