发明名称 |
Method And System For A Semiconductor For Device Package With A Die-To-Packaging Substrate First Bond |
摘要 |
Methods and systems for a semiconductor device package with a die-to-packing substrate first bond are disclosed and may include bonding a first semiconductor die to a packaging substrate, applying an underfill material between the first semiconductor die and the packaging substrate, and bonding one or more additional die to the first semiconductor die. The additional die may comprise electronic devices. The first semiconductor die may comprise an interposer die or may comprise electronic devices. The first semiconductor die may be bonded to the packaging substrate utilizing a mass reflow process or a thermal compression process. The additional die may be bonded to the first die utilizing a mass reflow process or a thermal compression process. The bonded die may be encapsulated in a mold material, which may comprise a polymer. The one or more additional die may comprise micro-bumps for coupling to the first semiconductor die. |
申请公布号 |
US2014134804(A1) |
申请公布日期 |
2014.05.15 |
申请号 |
US201213678058 |
申请日期 |
2012.11.15 |
申请人 |
KELLY MICHAEL G.;HUEMOELLER RONALD PATRICK;DO WON CHUL;HINER DAVID JON |
发明人 |
KELLY MICHAEL G.;HUEMOELLER RONALD PATRICK;DO WON CHUL;HINER DAVID JON |
分类号 |
H01L21/762 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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