| 摘要 |
The purpose of the present invention is to use a relatively simple production process to improve alignment accuracy of light emission elements and light receiving elements on substrates, and to inhibit crosstalk in signal transmission between the substrates (between chips). In an optical interconnection device (1) in which optical signals are transmitted and received between a plurality of stacked semiconductor substrates (10), a plurality of light emission elements (2) or light receiving elements (3) disposed on one of the semiconductor substrates (10) are provided with pn connection parts (10pn) where common semiconductor layers (10p) are provided to the semiconductor substrate (10). One (2-1) of the light emission elements (2) and one (3-1) of the light receiving elements (3), which configure a pair, and which transmit and receive optical signals between the different semiconductor substrates (10), respectively emit and receive light having a common wavelength of λ1. |
