发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
A semiconductor device and a manufacturing method thereof. The semiconductor device includes a semiconductor substrate (300) provided with a plurality of pads (301), columnar electrodes on the pads (301) and a solder ball (321) provided on the columnar electrode. The columnar electrode comprises a main body (307) and a groove in the main body (307), and an opening of the groove is overlapped with the top surface of the columnar electrode. The solder ball (321) comprises a metal bump (320) arranged on the top of the columnar electrode and a filling part (319) filled in the groove. The solder ball and the columnar electrode form a structure similar to a bolt; thus the binding force between the solder ball and the columnar electrode is improved. |
申请公布号 |
WO2014071815(A1) |
申请公布日期 |
2014.05.15 |
申请号 |
WO2013CN86214 |
申请日期 |
2013.10.30 |
申请人 |
NANTONG FUJITSU MICROELECTRONICS CO., LTD. |
发明人 |
LIN, CHANG-MING;SHI, LEI;TAO, YUJUAN |
分类号 |
H01L23/485;H01L21/48 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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