| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which inhibits deterioration in accuracy of the size and a shape of a pattern, which is caused because a parting line lies during a plurality of times of exposure processes.SOLUTION: A semiconductor device comprises: a semiconductor substrate SUB; and a plurality of light-receiving elements TMI arranged on a principal surface of the semiconductor substrate SUB. A plurality of regions where the plurality of light-receiving element TMI are arranged in a matrix are arranged on the principal surface of the semiconductor substrate SUB on which the plurality of light-receiving element TMI are arranged. A pitch P2 in a second direction crossing a first direction between the adjacent light-receiving elements across a parting line SPL which serves as a border between regions extending along the first direction along which the plurality of light-receiving elements TMI are arranged is greater than a repetition pitch P1 between the adjacent light-receiving elements in the regions. |
