发明名称 ELECTRONIC ELEMENT PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic element package capable of achieving both airtightness and antishock property.SOLUTION: A glass member 8 has a dual structure in its junction part composed by: a first junction 11 for surrounding an opening 7; and a second junction 12 having an extension part 13 alienating from the first junction 11 and extending to a side wall of the glass member 8. Owing to the dual structure, the first junction 11 secures an airtightness, the second junction 12 having the extension part 13 secures the junction intensity, and the alienation of these junctions secures an antishock property. Specifically, when there is a crack in the second junction 12 by an external impact or others, the crack terminates at the gap, preventing the crack from reaching the first junction 11. Consequently, a package 100 having airtightness and antishock property can be provided.</p>
申请公布号 JP2014090002(A) 申请公布日期 2014.05.15
申请号 JP20120237566 申请日期 2012.10.29
申请人 SEIKO EPSON CORP 发明人 KOIKE SHIGEMITSU
分类号 H01L23/02;H01L23/10;H01L31/02;H03H9/02;H03H9/10;H03H9/19;H03H9/215 主分类号 H01L23/02
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