MOLDED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To appropriately prevent a short-circuit between islands adjacent each other, in a molded package in which a plurality of the islands disposed to be apart from each other in plain on an insulating sheet are sealed with a mold resin.SOLUTION: A molded package includes: an insulating sheet 10 in which a one face 10a side is formed of a resin layer 11 comprising an electrically insulating resin; a plurality of islands 20 mounted to be apart from each other in plane on the one face 10a of the insulating sheet 10; an electronic component 30 mounted on one face 21 of each of the islands 20; and a mold resin 70 sealing the one face 10a of the insulating sheet 10, the islands 20 and the electronic components 30. The resin layer 11 has a thermal conductivity greater than that of the mold resin 70. A portion located between side faces 23 of the islands 20 adjacent each other in the one face 10a of the insulating sheet 10 constitutes a projecting part 13 rising while being in contact with both side faces 23.