发明名称 HEATING/COOLING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a heating/cooling device capable of executing both of a heating treatment and a cooling treatment in parallel, and also independently executing only one of the treatments.SOLUTION: A heating/cooling device includes: a heat pump 2 having a compressor 21; condensers 22a, 22b; an expansion valve 23; and evaporators 24a, 24b, and provided with a refrigerant flow channel configured so that a refrigerant discharged from the compressor 21 is successively passed through the condensers 22a, 22b, the expansion valve 23 and the evaporators 24a, 24b, and then sucked to the compressor 21, a heating treatment portion 32 for heating a heated object by heat radiation from the condenser 22a, a cooling treatment portion 42 for cooling a cooled object by heat absorption by the evaporator 24a, a fan 25a for adjusting a heat radiation amount from the condenser 22b, a fan 25b for adjusting a heat absorption amount by the evaporator 24b, and a control portion 7 for supplying the refrigerant to the refrigerant flow channel by controlling the compressor 21, adjusting the heat radiation amount by controlling the fan 25a, and adjusting the heat absorption amount by controlling the fan 25b.</p>
申请公布号 JP2014088975(A) 申请公布日期 2014.05.15
申请号 JP20120238025 申请日期 2012.10.29
申请人 ORION MACH CO LTD 发明人 NAKANE TAKAHIRO;YANAGISAWA KAZUTOSHI
分类号 F25B5/02;F25B6/02 主分类号 F25B5/02
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