发明名称 BEAKING APPARATUS OF BRITTLE MATERIAL SUBSTRATE AND BEAKING METHOD OF BRITTLE MATERIAL SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a breaking apparatus of a brittle material substrate and a breaking method of a brittle material substrate, capable of reducing cost of an adhesive film by enabling break of a substrate without using the adhesive film.SOLUTION: A substrate 100 is sucked and held on an elastic sheet member 101 by exhausting between the substrate 100 and the elastic sheet member 101 through a suction groove 72 and a suction port 71 by action of an exhaust part 74. When the substrate 100 is pressed by a break bar 14 in this state, a bending stress is generated in the substrate 100 by elastic force of the elastic sheet member 101, thereby breaking the substrate 100 at a position corresponding to a scribe line 99.
申请公布号 JP2014087936(A) 申请公布日期 2014.05.15
申请号 JP20120237683 申请日期 2012.10.29
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 TAKEDA MASAKAZU;MURAKAMI KENJI;TAMURA KENTA
分类号 B28D5/00;B26F3/00;C03B33/033;H01L21/301 主分类号 B28D5/00
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