发明名称 |
BEAKING APPARATUS OF BRITTLE MATERIAL SUBSTRATE AND BEAKING METHOD OF BRITTLE MATERIAL SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a breaking apparatus of a brittle material substrate and a breaking method of a brittle material substrate, capable of reducing cost of an adhesive film by enabling break of a substrate without using the adhesive film.SOLUTION: A substrate 100 is sucked and held on an elastic sheet member 101 by exhausting between the substrate 100 and the elastic sheet member 101 through a suction groove 72 and a suction port 71 by action of an exhaust part 74. When the substrate 100 is pressed by a break bar 14 in this state, a bending stress is generated in the substrate 100 by elastic force of the elastic sheet member 101, thereby breaking the substrate 100 at a position corresponding to a scribe line 99. |
申请公布号 |
JP2014087936(A) |
申请公布日期 |
2014.05.15 |
申请号 |
JP20120237683 |
申请日期 |
2012.10.29 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO LTD |
发明人 |
TAKEDA MASAKAZU;MURAKAMI KENJI;TAMURA KENTA |
分类号 |
B28D5/00;B26F3/00;C03B33/033;H01L21/301 |
主分类号 |
B28D5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|