| 摘要 |
A method of manufacturing a light emitting device package, includes following steps: providing a base which having a first surface and an opposite second surface, and electrical structures formed on the first surface, defining two through holes through the first and second surfaces; mounting a light emitting element on the first surface, the light emitting element having one pad on a top surface thereof; forming a mask on the first surface, the mask covering the light emitting element and defining at least one opening for exposing the at least one pad; electrically connecting the at least one pad to the electrical structures via at least one metal wire; filling liquid encapsulating material in a space between the mask and the first surface to form an encapsulating layer that encapsulating the light emitting element, the encapsulating layer being separated from the at least one metal wire and comprising phosphors therein. |
