| 摘要 |
A component carrier assembly (1) is provided which has a plurality of component carrier regions (10), which are intended for mounting semiconductor components. The component carrier assembly comprises a carrier body (2) with a first major face (21). On the first major face a trench pattern (3) is formed in the carrier body, with first trenches (31) extending parallel to one another in a first direction, the first trenches delimiting the component carrier regions in a second direction extending transversely of the trenches. A coating (4) is formed on the carrier body, such that the component carrier regions each have a first major face of the carrier body which is coated at least in places and a side face (5) of the trench pattern which is coated at least in places. |
