| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which meets a demand for improvement in mounting reliability.SOLUTION: A wiring board 3 according to one embodiment of the present invention comprises: a laminate 6 comprising a first inorganic insulating layer 11A disposed as an uppermost layer, a second inorganic insulating layer 11B disposed as a lowermost layer, a first resin layer 10A disposed on a lower surface of the first inorganic insulating layer 11A, and a plurality of resin layers 10 disposed between the first inorganic insulating layer 11A and the second inorganic insulating layer 11B; at least one internal wiring layer 7C disposed in the laminate 6; a first conductive pad 7A disposed on an upper surface of the first inorganic insulating layer 11A and electrically connected to an electronic component 2; and a first via conductor 8A penetrating at least the first inorganic insulating layer 11A and the first resin layer 10A and connecting the internal wiring layer 7C and the first conductive pad 7A. As a result, mounting reliability of the electronic component 2 in the wiring board 3 can be improved. |
