发明名称 FLEXIBLE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a flexible substrate which enables thickness reduction and downsizing.SOLUTION: A flexible substrate (10) of the invention includes multiple distribution lines including ground wiring (2), and conductive protruding parts (6) are provided on the ground wiring (2).</p>
申请公布号 JP2014090073(A) 申请公布日期 2014.05.15
申请号 JP20120239046 申请日期 2012.10.30
申请人 SHARP CORP 发明人 NAKAMURA MASAO
分类号 H05K1/02;H05K9/00 主分类号 H05K1/02
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