发明名称 VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus capable of maintaining a state in which vapor blown out of a vapor deposition source is always deposited on a substrate by alternately carrying out a vapor deposition stage and a vapor deposition pre-stage for a substrate installed in each vapor deposition region by a simple mechanism without moving the vapor deposition source between two vapor deposition areas.SOLUTION: A vapor deposition chamber 4 in which a first vapor deposition area 2 for vapor deposition on one substrate and a second vapor deposition area 3 for vapor deposition on the other substrate 1 is provided with a vapor deposition source 7 having a first vapor blowout part 5 for sticking a vapor deposition material on the one substrate 1 and a second vapor deposition blowout part 6 for sticking a vapor deposition material on the other substrate 1 arranged in the first vapor deposition area 2 and second vapor deposition area 3, and the vapor deposition source 7 is provided with vapor blowout part switching means 10 of performing switching so that vapor is blown out of only one of the first vapor deposition blowout part 5 and second vapor deposition blowout part 6, so that vapor deposition is carried out selectively on one of the substrates 1 in the first vapor deposition area 2 and second vapor deposition area 3.</p>
申请公布号 JP2014088591(A) 申请公布日期 2014.05.15
申请号 JP20120238199 申请日期 2012.10.29
申请人 CANON TOKKI CORP 发明人 WATANABE KAZUHIRO ; MISAWA KEITA ; MATSUMOTO EIICHI
分类号 C23C14/24;H01L51/50;H05B33/10 主分类号 C23C14/24
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