发明名称 |
VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus capable of maintaining a state in which vapor blown out of a vapor deposition source is always deposited on a substrate by alternately carrying out a vapor deposition stage and a vapor deposition pre-stage for a substrate installed in each vapor deposition region by a simple mechanism without moving the vapor deposition source between two vapor deposition areas.SOLUTION: A vapor deposition chamber 4 in which a first vapor deposition area 2 for vapor deposition on one substrate and a second vapor deposition area 3 for vapor deposition on the other substrate 1 is provided with a vapor deposition source 7 having a first vapor blowout part 5 for sticking a vapor deposition material on the one substrate 1 and a second vapor deposition blowout part 6 for sticking a vapor deposition material on the other substrate 1 arranged in the first vapor deposition area 2 and second vapor deposition area 3, and the vapor deposition source 7 is provided with vapor blowout part switching means 10 of performing switching so that vapor is blown out of only one of the first vapor deposition blowout part 5 and second vapor deposition blowout part 6, so that vapor deposition is carried out selectively on one of the substrates 1 in the first vapor deposition area 2 and second vapor deposition area 3.</p> |
申请公布号 |
JP2014088591(A) |
申请公布日期 |
2014.05.15 |
申请号 |
JP20120238199 |
申请日期 |
2012.10.29 |
申请人 |
CANON TOKKI CORP |
发明人 |
WATANABE KAZUHIRO ; MISAWA KEITA ; MATSUMOTO EIICHI |
分类号 |
C23C14/24;H01L51/50;H05B33/10 |
主分类号 |
C23C14/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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