发明名称 |
PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM |
摘要 |
A plating apparatus of performing a plating process by supplying a plating liquid onto a substrate includes a substrate holding/rotating device configured to hold and rotate the substrate; a discharging device configured to discharge the plating liquid toward the substrate; a plating liquid supplying device configured to supply the plating liquid to the discharging device; and a controller configured to control the discharging device and the plating liquid supplying device. Further, the discharging device includes a first nozzle having a discharge opening, and a second nozzle having a discharge opening configured to be positioned closer to a central portion of the substrate than the discharge opening of the first nozzle. Furthermore, the plating liquid supplying device is configured to set a temperature of the plating liquid supplied to the first nozzle to be higher than a temperature of the plating liquid supplied to the second nozzle. |
申请公布号 |
US2014134345(A1) |
申请公布日期 |
2014.05.15 |
申请号 |
US201214129623 |
申请日期 |
2012.06.04 |
申请人 |
INATOMI YUICHIRO;TANAKA TAKASHI;IWASHITA MITSUAKI;TOKYO ELECTRON LIMITED |
发明人 |
INATOMI YUICHIRO;TANAKA TAKASHI;IWASHITA MITSUAKI |
分类号 |
B05C5/00;B05D1/02 |
主分类号 |
B05C5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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