摘要 |
<p>The method involves printing (103) a print paste on a wafer surface by using a squeegee (205) through a screen mask (203), while moving (101) the squeegee relative to the screen mask. The relative speed between the squeegee and the screen mask is varied (105) during printing process, so that various regions of wafer surface are printed with different print speeds corresponding to the relative speed. The screen mask is provided with a contact template for printing contacts on the wafer surface, such that the relative speed is varied depending on the layout of contact template. Independent claims are included for the following: (1) device for printing on wafer surface; and (2) a computer program for printing on wafer surface.</p> |