发明名称 CHEMICAL-MECHANICAL POLISHING PAD HAVING SEALED WINDOW
摘要 PROBLEM TO BE SOLVED: To provide a new low-detect rate multilayer window polishing pad constitution for reducing window leakage to a sub-pad layer.SOLUTION: A polishing layer interface area and a porous sub-pad layer interface area are formed, and the areas are fixed to a porous sub-pad layer without an adhesive, and an adhesive layer is coated on an under surface of the porous sub-pad layer, and an inside opening extends up to a polishing surface 14 by penetrating through a multilayer chemical-mechanical polishing pad 10, and a light transmissive window element 40 is arranged in the inside opening, and contacts with the inner peripheral edge of the porous sub-pad layer, and the light transmissive window element is adhered to a pressure sensitive adhesive layer, and the porous sub-pad layer is applied to first critical compressive force, and forms a first irreversibly crushed high densifying area of the porous sub-pad layer, and the porous sub-pad layer is applied to second critical compressive force in the porous sub-pad layer, and forms a second irreversibly crushed high densifying area of the porous sub-pad layer, and the polishing surface is adapted for polishing a base material.
申请公布号 JP2014087925(A) 申请公布日期 2014.05.15
申请号 JP20130271079 申请日期 2013.12.27
申请人 ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC 发明人 STRING DARRELL;TURLEY JON WILLIAM
分类号 B24B37/22;H01L21/304 主分类号 B24B37/22
代理机构 代理人
主权项
地址