发明名称 ELECTRONIC COMPONENT INSPECTION DEVICE AND ELECTRONIC COMPONENT INSPECTION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic component inspection device capable of executing an electrical inspection of an electronic component having electrodes both on an upper surface and on a lower surface with good accuracy, and an electronic component conveyance method used for the electronic component inspection device.SOLUTION: An electronic component inspection device 10 includes: a first imaging device for imaging an upper surface electrode of an electronic component T before being held by a holding part; a second imaging device for imaging a contact terminal provided at a head 22 for an inspection; a third imaging device for imaging a lower surface electrode of the electronic component T being held by the holding part; and a fourth imaging device for imaging an inspection socket. Also, a control device is provided which controls a holding posture when the holding part holds the electronic component T based on an image imaged by the first and the second imaging devices, and a holding posture of the holding part holding the electronic component T with respect to the inspection socket based on an image imaged by the third and fourth imaging devices respectively, by making a position adjusting part for the head 22 for an inspection adjust the position of the holding part.</p>
申请公布号 JP2014089218(A) 申请公布日期 2014.05.15
申请号 JP20140031445 申请日期 2014.02.21
申请人 SEIKO EPSON CORP 发明人 SHIOZAWA MASAKUNI
分类号 G01R31/26 主分类号 G01R31/26
代理机构 代理人
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