发明名称 SURFACE TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To perform in high quality, a surface treatment such as an electroless plating treatment to a workpiece held in the vertical direction.SOLUTION: A liquid blowout part 4 having a blowout hole 6 is provided on each tank such as an electroless copper plating tank 200. A treatment liquid Q is blown out from the blowout hole 6 of the liquid blowout part 4 to the oblique upside with respect to a horizontal plane toward a planar workpiece 10, to thereby allow the treatment liquid Q to hit on an upper part of the planar workpiece 10 grasped by a hanger 16 for transportation. The treatment liquid Q is allowed to adhere onto the surface of the planar workpiece 10, while the treatment liquid Q is moved down the planar workpiece 10.
申请公布号 JP2014088600(A) 申请公布日期 2014.05.15
申请号 JP20120239795 申请日期 2012.10.31
申请人 C UYEMURA & CO LTD 发明人 HOTTA TERUYUKI;YAMAMOTO HISAMITSU;ISHIZAKI TAKAHIRO;UCHIUMI MASAYUKI;OKAMACHI TAKUYA;HOSHI SHUNSAKU;ASA FUJIO;MIZUMOTO JUNJI
分类号 C23C18/31;C25D17/00;C25D17/06;C25D17/08 主分类号 C23C18/31
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