发明名称 |
JUNCTION STRUCTURE AND ELECTRIC CONTACT |
摘要 |
<p>PROBLEM TO BE SOLVED: To join members together at a low cost without using brazing filler metal.SOLUTION: A junction structure comprises: a first member; a second member provided on the first member; and an attached and deposited layer attaching and depositing metal-containing powder over both the first member and the second member and joining the first member and the second member by thermal and mechanical alloying. The first member penetrating through the second member or the attached and deposited layer penetrating through the second member has a shape fitting with the second member.</p> |
申请公布号 |
JP2014089959(A) |
申请公布日期 |
2014.05.15 |
申请号 |
JP20130227832 |
申请日期 |
2013.11.01 |
申请人 |
HITACHI LTD |
发明人 |
KIKUCHI SHIGERU ; SATO TAKASHI ; MORITA AYUMI ; OKAMOTO KAZUTAKA ; YABU MASATO ; TSUCHIYA KENJI |
分类号 |
H01H33/664;B22F1/00;C22C1/10;C22C5/06;C22C9/00;C22C32/00 |
主分类号 |
H01H33/664 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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