发明名称 DICING AND DIE BONDING FILM WITH SEPARATOR
摘要 PROBLEM TO BE SOLVED: To provide a dicing and die bonding film with a separator, capable of easily peeling a dicing and die bonding film off from a separator.SOLUTION: The dicing and die bonding film with a separator formed by laminating a separator, a die bonding film having a projected extension piece on an outside at the periphery in plan view, and dicing film in this order.
申请公布号 JP2014090116(A) 申请公布日期 2014.05.15
申请号 JP20120240211 申请日期 2012.10.31
申请人 NITTO DENKO CORP 发明人 SUGAO YUKI;MURATA SHUHEI;ONISHI KENJI;KIMURA TAKEHIRO;YANAGI YUICHIRO;INOUE KOICHI
分类号 H01L21/301;C09J7/02;H01L21/52 主分类号 H01L21/301
代理机构 代理人
主权项
地址