发明名称 LIGHT EMITTING ELEMENT, LIGHT EMITTING ELEMENT MANUFACTURING METHOD, LIGHT EMITTING ELEMENT PACKAGE, AND LIGHTING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a light emitting element improved in light efficiency, a light emitting element manufacturing method, a light emitting element package, and a lighting system.SOLUTION: A light emitting element comprises: a conductive support layer 80; a transparent conducting layer 60 comprising a first region having first electrical conductivity and a second region having second electrical conductivity lower than the first electrical conductivity on the conductive support layer 80; a light emitting structure layer 50 comprising a first conductive type semiconductor layer 20, a second conductive type semiconductor layer 40, and an active layer 30 between the first conductive type semiconductor layer 20 and the second conductive type semiconductor layer 40 on the transparent conducting layer 60; and an electrode 90 having at least a portion disposed in a region overlapping the second region in a vertically direction on the light emitting structure layer 50.
申请公布号 JP2014090197(A) 申请公布日期 2014.05.15
申请号 JP20130266897 申请日期 2013.12.25
申请人 LG INNOTEK CO LTD 发明人 MOON JI HYUNG;KIM SO JUNG;SON JUN-O;JEONG WAN HUI
分类号 H01L33/14;H01L33/00;H01L33/32;H01L33/42 主分类号 H01L33/14
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