发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 Disclosed herein is a printed circuit board, including: a mounting substrate having a cavity formed therein; an electronic component inserted into the cavity; and a base substrate formed at least one of an upper part and a lower part of the electronic component, inserted into the cavity, and having an upper substrate pad and a lower substrate pad extended outwardly thereof and connected to each other.
申请公布号 US2014131083(A1) 申请公布日期 2014.05.15
申请号 US201313831842 申请日期 2013.03.15
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK SUNG YEOL;HAM SUK JIN;NOH JUNG EUN
分类号 H05K1/18;H05K3/30 主分类号 H05K1/18
代理机构 代理人
主权项
地址