| 发明名称 |
AMIDE-SUBSTITUTED SILICONES AND METHODS FOR THEIR PREPARATION AND USE |
| 摘要 |
<p>[0096] A COMPOSITION INCLUDES: (A) AN AMIDE-SUBSTITUTED SILICONE AND (B) A THERMALLY CONDUCTIVE FILLER. THE COMPOSITION MAY BE USED AS A THERMAL INTERFACE MATERIAL FOR DISSIPATING HEAT FROM ELECTRONIC DEVICES.</p> |
| 申请公布号 |
MY151325(A) |
申请公布日期 |
2014.05.15 |
| 申请号 |
MY2005PI03334 |
申请日期 |
2005.07.20 |
| 申请人 |
DOW CORNING CORPORATION |
发明人 |
BIANXIAO ZHONG;ZUCHEN LIN |
| 分类号 |
C08G77/388 |
主分类号 |
C08G77/388 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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