发明名称 LOW INDUCTANCE FLEX BOND WITH LOW THERMAL RESISTANCE
摘要 <p>PROBLEM TO BE SOLVED: To reduce an inductance component in wire connection between devices.SOLUTION: A flex circuit 604 for interconnecting devices 606 and 608 comprises: a cut slot 614 that defines a flexible bridge; and a conductive trace 610 extending along the flexible bridge. One end of the conductive trace is connected to one device 606, and another end is connected to the other device 608 through a vertical via. An inductance component can be reduced by locating the conductive trace and a return current, which flows on the opposite surface of the flexible bridge, at the same position on the opposite surfaces.</p>
申请公布号 JP2014090170(A) 申请公布日期 2014.05.15
申请号 JP20130219797 申请日期 2013.10.23
申请人 LSI CORP 发明人 DONALD R LATURELL;SAID E ABDELLI;PETER KISS;JAMES F MACDONALD;WILSON ROSS S
分类号 H05K1/02;H05K1/18 主分类号 H05K1/02
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