发明名称 PARTING METHOD AND SCRIBE DEVICE OF MULTILAYER CERAMIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To part a multilayer ceramic substrate where metal films are laminated on a ceramic substrate.SOLUTION: Grooving of the metal films 32, 33 of a multilayer ceramic substrate 30 is carried out along a scribe line by using a patterning tool. A scribe line is then formed in a ceramic substrate 31 by means of a scribe device along the groove 32a or 33a of the metal film 32 or 33. Subsequently the multilayer ceramic substrate 30 is inverted, and broken along the scribe line. Consequently, the multilayer ceramic substrate 30 can be parted completely.
申请公布号 JP2014090053(A) 申请公布日期 2014.05.15
申请号 JP20120238721 申请日期 2012.10.30
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 TAKEDA MASAKAZU;MURAKAMI KENJI;TAMURA KENTA
分类号 H05K3/00;B28D5/00 主分类号 H05K3/00
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