EPOXY RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition that can be impregnated in a substrate even if a filler is contained in an amount of 260 pts.mass or more based on 100 pts.mass of a solid content and can produce a prepreg having no tackiness, having good handleability and being easy to be molded.SOLUTION: The epoxy resin composition comprises an epoxy resin, a curing agent and a filler and contains the filler in an amount of 260 pts.mass or more based on 100 pts.mass of a solid content. A non-liquid type epoxy resin is used as an epoxy resin. The non-liquid type epoxy resin is contained in an amount of 50 mass% or more based on the total of the solid content. A first silica particle being a spherical silica particle having an average particle size of not less than 0.1 μm to less than 1.0 μm, a second silica particle being a spherical silica particle having an average particle size of not less than 1.0 μm to not more than 5.0 μm and a third silica particle being a spherical silica nanoparticle having an average particle size of not less than 20 nm to not more than 200 nm are used as a filler. The third silica particle is contained in an amount of not less than 30 pts.mass to less than 90 pts.mass based on 100 pts.mass of the solid content.