| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head in which possibility of occurring displacement of a substrate is reduced.SOLUTION: A thermal head X1 includes: a substrate 7; a plurality of heating parts 9 that are provided on the substrate 7 and arranged in a row; an electrode that is provided on the substrate 7 and electrically connected to the heating parts 9; a radiator 1 on which the substrate 7 is mounted; and connection members 6 and 8 for connecting the substrate 7 with the radiator 1. On a first surface 7d that faces the radiator 1 of the substrate 7, a first coating layer 2 for coating a part of the electrode and a second coating layer 4 separated from the first coating layer 2 are provided. Between the first coating layer 2 and the second coating layer 4, the connection members 6 and 8 are arranged. |
