| 摘要 |
PROBLEM TO BE SOLVED: To provide an ink for ink-jet which can form a cover lay or a solder resist with reduced warpage and heat resistance, and in superior balance of such as flexibility.SOLUTION: An ink for ink-jet containing epoxy resin (A) of a dicyclopentadiene type contains a compound (B) having a phenolic hydroxyl group and/or a carboxyl group, a diluent (C) and a photoinitiator (D) in addition if necessary. A curing membrane with reduced warpage and high heat resistance is formed by the ink for ink-jet. |
