SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package improved in insulation reliability, and a method for manufacturing the same.SOLUTION: A semiconductor package includes: a copper lead frame 10 having a lead frame upper face 10t, a lead frame lower face 10b and a lead frame side face 10s; a semiconductor element 40 mounted on the lead frame upper face 10t; a metal frame 20 surrounding the lead frame side face 10s; and a sealing resin 60 not covering an insulating film 30 formed on the lead frame lower face 10b and a metal frame lower face 20b and covering the insulating film 30 formed on a portion other than the exposed portion in the lead frame 10 and the metal frame 20. The insulating film 30 formed on the lead frame side face 10s is integrated with the insulating film 30 formed on a metal frame inner side face 20is. The semiconductor package can secure an insulation property even when water immersion from an interface between the insulating film 30 and the sealing resin 60 occurs, since the lead frame 10 is spaced from water.