发明名称 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
摘要 A plasma processing apparatus includes: a processing chamber in which plasma processing is performed; a gas feeding unit which supplied process gas into the processing chamber; a radio-frequency power source which supplies radio-frequency power that turns the process gas fed into the processing chamber to plasma; and a light detector which detects the light emitted from the plasma generated in the process chamber. The light detector includes a detecting unit which detects, during respective preset exposure times, the light emitted from the plasma that is generated due to pulse-modulated radio-frequency power, and a control unit which performs control such that the amount of the light emitted from the plasma during each of the preset exposure times becomes constant.
申请公布号 US2014131314(A1) 申请公布日期 2014.05.15
申请号 US201313761222 申请日期 2013.02.07
申请人 HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 ANDO YOJI;ONO TETSUO;USUI TATEHITO
分类号 B05C11/00 主分类号 B05C11/00
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