| 发明名称 |
RESIN COMPOSITION, AND LAMINATE FOR PRINTED CIRCUIT BOARD COMPRISING SAME |
| 摘要 |
The present invention relates to a resin composition acting as an insulation layer of a laminate for a printed circuit board while exhibiting adhesiveness to a metal base layer, wherein the resin composition comprises a rubber-modified epoxy resin, epoxy resin, inorganic filler, and hardener. |
| 申请公布号 |
WO2014073789(A1) |
申请公布日期 |
2014.05.15 |
| 申请号 |
WO2013KR08824 |
申请日期 |
2013.10.02 |
| 申请人 |
DOOSAN CORPORATION |
发明人 |
LEE, HANG SEOK;HAN, DUK SANG;JUNG, YOON HO;YANG, DONG BO |
| 分类号 |
C08L51/04;B32B15/092;C08L63/00;H05K1/03 |
主分类号 |
C08L51/04 |
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