| 摘要 |
The present invention provides a method of fabricating a circuit board by filling conductive paste. After a non-conductive master substrate having a pillar part is prepared from a conductive master mold, a circuit board is fabricated by filling the conductive paste made by mixing conductive powder with adhesive liquid resin between the pillars of the master substrate. The circuit board according to the present invention includes a circuit part and a pillar part. The circuit part is formed by filling a space part with conductive adhesive resin such as silver paste, and the pillar part adheres to a non-conductive substrate. The pillar part and the circuit part prepared as described above are coupled to each other on the substrate. Since the pillar part and the circuit part firmly adhere to each other, the pillar part and the circuit part are resistant to an external shock. Generally, a circuit part fabricated with silver paste is easily oxidized. However, the circuit part of the circuit board has an oxidation resistant wall surrounding the silver pastes and is prevented from being oxidized. In addition, since a height of the circuit part can be adjusted by the height of a photosensitive material, the circuit part can be fabricated to have a desired thickness. |
