| 发明名称 |
STUD BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A stud bump structure and a method for manufacturing the same are provided. A stud bump structure includes a substrate and a first Ag alloy stud bump which is arranged on the substrate. The first Ag alloy stud bump has the weight percentage ratio of Ag : Au : Pd = 60-99.98 : 0.01-30 : 0.01-10. |
| 申请公布号 |
KR20140059117(A) |
申请公布日期 |
2014.05.15 |
| 申请号 |
KR20130092982 |
申请日期 |
2013.08.06 |
| 申请人 |
WIRE TECHNOLOGY CO., LTD. |
发明人 |
CHUANG TUNG HAN;TSAI HSING HUA;LEE JUN DER |
| 分类号 |
H01L21/60;H01L23/488 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
