HEAT CURABLE CONDUCTIVE PASTE

摘要

PROBLEM TO BE SOLVED: To provide a heat curable conductive paste which can be treated at a low temperature, for example, at 200°C or less and can obtain a conductive film having a low specific resistance.SOLUTION: There is provided a heat curable conductive paste which comprises: (A) silver particles; (B) an oxetanyl group-containing polysilsesquioxane; (C) a phthalic acid glycidyl ester type epoxy resin; and (D) a cationic polymerization initiator. The heat curable conductive paste preferably further contains (E) a hydroxyl group-containing oxetane compound. The (B) oxetanyl group-containing polysilsesquioxane is preferably a poly[[3-[(3-ethyl-3-oxetanyl)methoxy]propyl]silsesquioxane derivative. The (C) phthalic acid glycidyl ester type epoxy resin is preferably a hexahydrophthalic acid diglycidyl ester.