| 摘要 |
PROBLEM TO BE SOLVED: To provide a workpiece cutting method by wire saw which can prevent generation of breakage or crack to a wafer.SOLUTION: A wire 12 is wound by plural cycles between plural rollers for processing 11. By rotation of the rollers for processing 11, by the wire 12 running between the rollers for processing 11, a workpiece 15 supported on a support plate 14 is cut. On an outside surface of a cutting completion side of the workpiece 15, a hard outside layer 17 is provided. The hard outside layer 17 is harder than adhesive. |
