发明名称 SUSPENSION SUBSTRATE, SUSPENSION, SUSPENSION WITH HEAD, HARD DISK DRIVE, SUSPENSION SUBSTRATE MANUFACTURING METHOD AND SUSPENSION MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a suspension substrate that can improve workability for connecting a suspension substrate and an actuator element by a conductive adhesive.SOLUTION: The suspension substrate 1 according to the present invention comprises: an insulation layer 10; a metal support layer 11 that is provided on one face of the insulation layer 10; and a wiring layer 12 that is provided on the other face of the insulation layer 10 and has a plurality of pieces of wiring 13 and a wiring connection part 16 to be electrically connected to an actuator element 44 via the conductive adhesive. The metal support layer 11 is provided in a connection structure region 3, and has a frame body part 17 including a metal support layer injection hole 32 to which the conductive adhesive is poured. An outer ridge 17a of the frame body part 17 of the metal support layer 11 is positioned further inward than an outer edge 10a of an insulation layer 10. An observation hole 30 is provided that is capable of externally observing a state of the conductive adhesive upon pouring the conductive adhesive into the metal support layer injection hole 32 by penetrating the insulation layer 10.</p>
申请公布号 JP2014089797(A) 申请公布日期 2014.05.15
申请号 JP20140007197 申请日期 2014.01.17
申请人 DAINIPPON PRINTING CO LTD 发明人 ONUKI MASAO;YAMAZAKI TSUYOSHI
分类号 G11B21/21;G11B5/60;G11B21/10 主分类号 G11B21/21
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