发明名称 MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR
摘要 There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≰(B+C)/A≰1.745.
申请公布号 US2014133064(A1) 申请公布日期 2014.05.15
申请号 US201313764193 申请日期 2013.02.11
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 AHN YOUNG GHYU;PARK SANG SOO;PARK MIN CHEOL;LEE BYOUNG HWA
分类号 H01G4/01 主分类号 H01G4/01
代理机构 代理人
主权项
地址