发明名称 |
Methods for Fabricating Integrated Passive Devices on Glass Substrates |
摘要 |
A method includes forming a plurality of dielectric layers over a semiconductor substrate; and forming integrated passive devices in the plurality of dielectric layers. The semiconductor substrate is then removed from the plurality of dielectric layers. A dielectric substrate is bonded onto the plurality of dielectric layers. |
申请公布号 |
US2014134801(A1) |
申请公布日期 |
2014.05.15 |
申请号 |
US201414157287 |
申请日期 |
2014.01.16 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN WEN-CHAO;MAO MING-RAY;YANG SHIH-HSIEN;TSAI KUAN-CHI |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|