SUBSTRATE HOLDER AND A DEVICE AND A METHOD FOR TREATING SUBSTRATES

摘要

A substrate holder comprising a plate element for receiving a substrate is described. The plate element has at least one depression in a first side of the plate element, and a multiplicity of spacers in the at least one depression, at least one opening which is flow-connected to the depression and is connectable to an external gas supply/extraction unit, at least one groove which radially surrounds the depression, at least one opening which is flow-connected to the groove and is connectable to an external gas supply/extraction unit, a circumferential web which radially surrounds the depression and lies between depression and groove, and circumferential bearing surfaces for the substrate, wherein a first circumferential bearing surface is formed at the top side of the web and radially surrounds the depression, such that a substrate bearing on the first bearing surface forms with the depression a closed chamber, and a second circumferential bearing surface, which radially surrounds the groove. Furthermore, a device and a method for treating substrates, more particularly semiconductor substrates, are described. The device comprises at least one substrate holder of the type described above which is arranged or can be received in a process chamber, and at least one radiation source arranged for emitting radiation into the process chamber. In the method, a substrate is taken up by suction on a first side of the substrate in a suction region, which radially surrounds a first process region at the first side of the substrate, in such a way that suction region and process region are separated, and a first gas atmosphere is applied to a second side of the substrate and a second gas atmosphere is applied to the first side of the substrate in the first process region, wherein the first and second gas atmospheres differ from one another.