| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board whose reliability can be improved, since no minute crack is produced on a ceramic board when bonding a copper electrode to the ceramic circuit board by ultrasonic bonding, and a method of manufacturing the same.SOLUTION: In the ceramic circuit board formed by bonding a copper circuit to one side of a ceramic board 1 and a copper heat sink 3 to the other side by a brazing filler metal containing Ti as an active metal, specular glossiness of the ceramic board 1 is 5.0 or greater, the bonding void of the ceramic circuit board is 10% or less, and the brazing filler metal layer 4 of the ceramic circuit board has a structure in which an alloy containing Cu is dispersed in an alloy containing Ag, the thickness thereof is 11-24 μm, the thickness of a Ti compound is 0.4-0.6 μm, and the occupied area of the compound is 12-85%. There is also provided a method of manufacturing the ceramic circuit board. |
