| 摘要 |
<p>PROBLEM TO BE SOLVED: To form a thick plated through hole having high reliability, and to form a wiring pattern of a precise fine circuit by a thin metal plating layer with little variation in thickness.SOLUTION: A printed wiring board is manufactured by the steps of: providing a first metal plating layer on upper and lower surfaces of a laminated substrate of an insulating resin, in which a through hole is formed, and on an inner wall surface of the through hole; forming a tin plating layer on the first metal plating layer except for the inside of the through hole; providing a second metal plating layer on the entire surface of the laminated substrate; thereafter filling the through hole with a hole filling material; removing the second metal plating layer by soft etching to expose the tin plating layer; peeling off the tin plating layer to expose the first metal plating layer on the upper and lower surfaces; and etching the first metal plating layer to form a surface layer wiring pattern.</p> |
