| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve bond strength of a radio IC device for a printed-circuit board.SOLUTION: A printed-circuit board 20 comprises: a radio IC device 1 with a feeding circuit board 10 having a radio IC 5 processing a transmit and receive signal and a feeding circuit connected to the radio IC 5; and emission plates 21a and 21b which are electromagnetic field-bound to the feeding circuit. The radio IC device 1 is provided with electrodes 18a and 18b for mounting which are not connected to the feeding circuit electrically, and is fixed to the printed-circuit board 20 by the electrodes 18a and 18b for mounting. The feeding circuit board 10 has electrodes 19a and 19b for emission which are electromagnetic field-bound with the emission plates 21a and 21b built-in.</p> |
