METHOD FOR MANUFACTURING METAL PRINTED CIRCUIT BOARD
摘要
<p>The present invention provides a method for manufacturing a metal printed circuit board, comprising the steps of: printing a light reflection layer on a release film; printing a circuit pattern on the light reflection layer; forming a thermal conductive insulation layer on the circuit pattern; and removing the release film.</p>
申请公布号
WO2014073876(A1)
申请公布日期
2014.05.15
申请号
WO2013KR10064
申请日期
2013.11.07
申请人
INKTEC CO., LTD.;HAEUN PNC CO., LTD.
发明人
CHUNG, KWANG CHOON;YOON, KWANG BAEK;AHN, HEE YONG;HAN, YOUNG KOO;YOO, MYUNG BONG;CHO, NAM BOO;ON, WOONG KU
